Test handler

ABSTRACT

A test handler is disclosed in the present invention. The test handler may include a test tray on which a plurality of inserts are arrayed for loading at least one semiconductor device, at least one opening unit for simultaneously opening one part of the plurality of inserts which are arrayed on one part of the test tray, and a test tray transfer apparatus for allowing the opening unit to simultaneously open other parts of the plurality of inserts which are arrayed on another part of the test tray as the test tray is transferred. Therefore, although semiconductor devices to be tested change their sizes, the replaced parts of the test handler are reduced in number, thereby reducing manufacturing cost and replacement work time. The inventive test handler reduces semiconductor devices loading time, reduces jamming, increases teaching efficiency and improves space utilization efficiency. Furthermore, the test handler can be applied to various types of testers.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. §119(a) of KoreanPatent Application No. 10-2006-0068167, filed on Jul. 20, 2006, in theKorean Intellectual Property Office, the entire disclosure of which ishereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a test handler, and, more particularly,to a loading part of a test handler for transferring and loadingsemiconductor devices to a tray.

2. Description of the Related Art

In general, a test handler supports testing of semiconductor devicesmanufactured by a predetermined manufacturing process, sorts thesemiconductor devices into different levels according to the testresults, and loads the semiconductor devices onto user trays. Testhandlers have been disclosed in many published documents.

FIG. 1 is a schematic perspective view illustrating a conventional testhandler 100. The major parts of the conventional test handler 100 willnow be briefly described with reference to FIG. 1.

The conventional test handler 100 includes a loading apparatus 110, asoak chamber 120, a test chamber 130, a de-soak chamber 140, anunloading apparatus 150, two insert-opening apparatus 160 a and 160 b,and two posture changing apparatus 170 a and 170 b. Each part of thetest handler 100 will be described in more detail below.

The loading apparatus 110 transfers and loads semiconductor devicesloaded on user trays 10 a to a test tray 11 a posed at a present loadingposition.

The soak chamber 120 has a temperature environment forpre-heating/pre-cooling the semiconductor devices loaded on the testtray. The soak chamber 120 sequentially receives the test trays on whichthe semiconductor devices are loaded by the loading apparatus 110. Afterthe test tray enters the soak chamber 120, the test tray is translatedclosely toward the test chamber 130 and arranged sequentially with itsvertical posture. While translating, the semiconductor devices loaded onthe test tray are sufficiently pre-heated/pre-cooled.

The test chamber 130 is installed to the test handler, for testing thesemiconductor devices loaded onto two test trays 11 b and 11 ctranslated from the soak chamber 120. For this, the test chamber 130 hasa temperature environment for testing the semiconductor devices.

The de-soak chamber 140 (or a ‘restoring chamber’) restores the heatedor cooled semiconductor devices to normal temperature.

The unloading apparatus 150 sorts the semiconductor devices loaded onthe test tray outputted from the de-soak chamber 140 into differentlevels, and transfers and loads (an unloading step) the semiconductordevices onto a user tray 10 b.

Here, the loading apparatus 110 or the unloading apparatus 150 includesat least one pick and place apparatus (not shown) for adsorbing andwithdrawing the semiconductor devices loaded on the user trays or thetest tray, and for supplying the semiconductor devices to the user traysor the test tray. For example, the pick and place apparatus adsorbs andwithdraws the semiconductor devices from the user tray and then suppliesthem to the test tray in a loading operation. The pick and placeapparatus adsorbs and withdraws the semiconductor devices from the testtray and then supplies them to a sorting table (not shown), or from thesorting table to the user trays in an unloading operation.

On the other hand, the two insert-opening apparatus 160 a and 160 b openinserts arrayed as a matrix-form on the test trays 11 a and 11 bcorrespondingly situated above their upper sides, respectively, suchthat the loading apparatus 110 or unloading apparatus 150 can performloading or unloading, respectively.

The posture changing apparatus 170 a changes the horizontal posture ofthe test tray 11 a to the vertical posture thereof. The posture changingapparatus 170 b changes the vertical posture of the test tray translatedfrom the de-soak chamber 140 to the horizontal posture thereof.

The following is a more detailed description for the posture changing ofthe test tray in the test handler 100.

Firstly, an empty test tray like a test tray 11 a is situated at thelower side of the loading apparatus 110. After semiconductor devices areloaded on the empty test tray (and becomes a test tray), the test trayis transferred to the posture changing apparatus 170 a sited at the backside of the loading apparatus 110, and then posture-changed. Thereafter,the test tray is translated to the backside of the soak chamber 120 andthen enters the test chamber 130. The test tray is horizontallytransferred in two rows (or one row), upper and lower, in the testchamber 130. Here, the semiconductor devices on the test tray are testedby a tester (not shown) located at the middle portion of the testchamber 130. After being forwardly translated through the de-soakchamber 140, the test tray of the vertical posture is supplied to theposture changing apparatus 170 b located at the backside of theunloading apparatus 150. The posture changing apparatus 170 b changesthe vertical posture of the test tray to the horizontal posture. Thehorizontally posture-changed test tray is transferred to the unloadingapparatus 150 to unload the semiconductor devices. After unloading, thetest tray is transferred to the lower direction of the loading apparatus110. As such, the test tray performs sequentially the above-describedprocedure to test the semiconductor devices loaded thereon.

After loading the semiconductor devices onto the inserts arrayed in amatrix-form, the test tray is transferred, posture-changed, and tested.To achieve these operations, the inserts must have a mechanicalconfiguration to stably receive the semiconductor devices. Such aconfiguration was already published in Korean Patent No. 10-0486412,entitled “TEST TRAY INSERT OF TEST HANDLER” that was filed by theapplicant of this application (hereinafter, referred to as a ‘citedapplication’) and which is hereby incorporated by reference. Asdisclosed in the cited application, the inserts are configured toinclude a housing for receiving the semiconductor devices, a pair ofstoppers for opening the insert as the stoppers rotate to release theinsert at both the ends of the housing, and a pair of lockerselastically supported by compression springs, for preventing rotation ofthe stoppers and linearly being movable. Therefore, as long as thelockers do not overcome the elastic forces of the compression springsand move linearly to release the stoppers, in other words, as long asthe inserts are not opened, the semiconductor devices cannot be receivedor separated by or from the housing.

However, when the loading apparatus 110 performs such a loading, theinserts must be opened to allow the housing to receive the semiconductordevices stably. Also, when the unloading apparatus 150 performs such anunloading, the insert must be opened to separate the semiconductordevices from the housing. Therefore, in order to open the inserts, thetwo insert-opening apparatus 160 a and 160 b, each correspondinglylocated at the lower sides of the loading apparatus 110 and unloadingapparatus 150, must operate the lockers to release the stoppers, inwhich the test trays 11 a and 11 d are each sited between theinsert-opening apparatus 160 a and the loading apparatus 110 and betweenthe insert-opening apparatus 160 b and the unloading apparatus 150.

FIG. 2 is a schematic perspective view illustrating a conventionalinsert-opening apparatus (160 a or 160 b).

The conventional insert-opening apparatus (160 a or 160 b) includes abase plate 161, a base cylinder 162 for linearly transferring the baseplate 161 toward a test tray, and four opening units 163 a, 163 b, 163 cand 163 d which are mounted on the base plate 161 in a 2×2 matrix formalong the test tray direction. The four opening units 163 a, 163 b, 163c and 163 d correspondingly include: plate openers 163 a-1, 163 b-1, 163c-1 and 163 d-1, each of which occupies a quarter of the test tray andarrays a plurality of pairs of opening pins 163-1 in a 2×8 matrix form,which are integrally formed, in which the plat opener 163 a-1, forexample, opens the inserts in the quarter area allocated theretosimultaneously; and ascending/descending cylinders 163 a-2 and 163 c-2for linearly transferring the plate openers 163 a-1, 163 b-1, 163 c-1and 163 d-1 toward the test tray. Here, the plate openers are describedas a ‘site decision unit’ in the cited application. On the other hand,FIG. 2 does not show ascending/descending cylinders for linearlytransferring the plate openers 163 b-1 and 163 d-1.

The following is a description of operations of the conventionalinsert-opening apparatus 160 a and 160 b shown in FIG. 2.

Firstly, the base cylinder 162 transfers the base plate 161 closely tothe test tray to secure a necessary distance for opening operations ofthe opening units 163 a, 163 b, 163 c and 163 d. After that, any one ofthe four opening units 163 a, 163 b, 163 c and 163 d, for exampleopening unit 163 a, operates to open the inserts arrayed in the quarterarea corresponding to the opening unit 163 a. For example, when theascending/descending cylinder 163 a-2 transfers the plate opener 163 a-1toward the test tray, the pairs of opening pins 163-1 of the plateopener 163 a-1 push and linearly transfer pairs of lockers mounted ineach inserts, and rotate pairs of stoppers, thereby opening the insert.

As such, each of the four opening units 163 a, 163 b, 163 c and 163 dopens 16 inserts arrayed in ¼ area of the test tray, respectively, suchthat the whole inserts arrayed in the test tray can be opened. Morespecifically, the four opening units 163 a, 163 b, 163 c and 163 doperate sequentially as follows: for example, after the opening unit 163a opens the inserts arrayed in a quarter of the test tray allocatedthereto and the semiconductor devices are loaded or separated in or fromthe opened inserts, the inserts are closed; and then, the opening unit163 b opens the inserts arrayed in another quarter of the test rayallocated thereto, and so on.

As such, the opening units 163 a, 163 b, 163 c, and 163 d aresequentially operated so as not to apply a relatively large force to thetest tray, which may cause the test tray to bend. More specifically,when the four opening units are operated simultaneously, a relativelylarge force may be applied to the test tray, and when such a largeforce-applying state is maintained for a long time, the test tray maybend. Accordingly, a pick and place device including the loadingapparatus 110 and unloading apparatus 150 should be configured to belight for a rapid processing speed and a rapid response speed. The pickand place apparatus is generally configured to adsorb and transfer nomore than 16 semiconductor devices. Therefore, since it is enough thatthe inserts are opened in concert with a one-time processing capacity ofthe pick and place apparatus (as only the number of insertscorresponding to the one-time processing capacity is sequentiallyopened), the force applied to the test tray can be minimized to preventthe test tray from bending.

On the other hand, the test handler is tending to be developed to test anumber of semiconductor devices at a time. Presently, a test trayarraying 32 or 64 inserts is commonly used, but, recently, a large-sizedtest tray having 128 or 160 inserts has been developed and will be soldon the market.

However, due to a structural restriction, the pick and place apparatusstill has the capacity to test a maximum of 16 inserts. Therefore, inthe case when a large-sized test tray is used, where 8 or 10 openingunits should be installed, the production cost of the test handler wouldbe increased.

Also, when the type of semiconductor devices to be tested is changed ornew type of tester is applied to the test handler, the test tray must bereplaced. In this case, additional work should be done, such asadjusting the distance between a pair of opening pins. Therefore, all ofthe opening units, etc., should be replaced, respectively. When 8 or 10opening units are installed to a large-sized test tray, such replacementwork requires a lot of time and increased replacement costs, and causesa waste of resources.

Also, when a large-sized test tray is applied, the pick and placeapparatus should perform transferring and loading the semiconductordevices at positions corresponding to 8 or 10 opening units,respectively. With an increase of transferring points, jams occurfrequently. When the pick and place apparatus performs a teaching (whichmeans ‘to measure’ and ‘to input’ starting points and end points ofmovements of apparatuses driven by a motor), all positions correspondingto the 8 or 10 opening units should be applied. So the teaching will bedifficult and take more time.

On the other hand, there is a waste of time in the loading part while atest tray is transferred. When a loading to test tray is completed, thebase cylinder takes down the base plate to take down the insert-openingapparatus. After the loading-completed test tray is transferred to arotator and confirmation is performed to insure that no test tray is inthe loading part, another test tray is pushed to enter the lower side ofthe loading part. The insert-opening apparatus is lifted up to situatethe test tray to a loading position, and then the opening units and thepick and place apparatus each perform a loading again. As such, sincethe pick and place apparatus should stop its operation during a timeinterval between a time point when one test tray completes its loadingand a time point when another test tray starts its loading, the loadingtime is extended, which is disadvantageous in the conventional testhandler.

SUMMARY OF THE INVENTION

The present invention has been made in view of the above problems anddisadvantages, and it is an object of the present invention to provide atest handler which is operable in such a way that inserts, arrayed in apart of a test tray, are opened and then inserts, arrayed in anotherpart of the test tray, are opened as the test tray is transferred.

In an exemplary embodiment of the present invention, the above objectcan be accomplished by the provision of a test handler comprising: afirst loading member on which a plurality of semiconductor devices areloaded; a second loading member for loading the plurality ofsemiconductor devices; and a pick and place apparatus for transferringand supplying the semiconductor devices of the first loading member tothe second loading member. Here, the second loading member repeatedlyperforms transfer and stop operations, in response to the semiconductordevices supplying operation of the pick and place apparatus such thatthe supplying position of the pick and place apparatus in relation tothe second loading member is always substantially invariant.

In an exemplary embodiment, the test handler may further include: atransferring apparatus for transferring and stopping the second loadingmember; and an opening apparatus for assisting the pick and placeapparatus to load the semiconductor devices to the second loadingmember.

In an exemplary embodiment, the second loading member may include atleast one picking hole, and at least one sensing hole. The transferringapparatus may include a picking unit for picking the picking hole and asensing unit for sensing the sensing hole. The opening apparatus mayinclude a sensing unit for sensing the sensing hole.

In accordance with another aspect of the present invention, there isprovided a test handler comprising: a test tray on which a plurality ofinserts for loading at least one semiconductor device are arrayed; atleast one opening unit for simultaneously opening one part of theplurality of inserts, which are arrayed on one part of the test tray;and a test tray transfer apparatus for transferring the test tray. Here,the opening unit may open simultaneously a plurality of inserts in onepart of the test tray, and the test tray transfer apparatus may transferthe test tray to make the opening unit simultaneously open a pluralityof inserts in another part of the test tray.

In an exemplary embodiment, the test handler may further include a pickand place apparatus for supplying the semiconductor devices to andwithdrawing the semiconductor devices from the test tray. Here, the testtray transfer apparatus may transfer the test tray, regardless ofoperations of the pick and place apparatus.

In an exemplary embodiment, the test handler may further include aloading part for receiving the test tray and loading the semiconductordevices on the test tray. Here, the loading part may include the openingunit and the test tray transfer apparatus.

In an exemplary embodiment, the loading part includes a cover forcovering most parts of the test tray received to the loading part. Thecover forms an opening section for exposing a plurality of insertsarrayed on a part of the test tray. In an exemplary embodiment, the testtray includes: at least one picking hole formed at a part of the testtray; and at least one sensing hole formed at a part of the test tray.

In an exemplary embodiment, the picking hole is arrayed in a row in theproceeding direction of the test tray. The sensing hole may be arrayedin a row in the proceeding direction of the test tray.

In an exemplary embodiment, the opening unit includes: an opener forcontacting and opening the plurality of inserts arrayed on the part ofthe test tray; and a linear transfer apparatus for transferring theopener to the plurality of inserts such that the opener can contact theplurality of inserts.

In an exemplary embodiment, the opening unit is formed as a module to beseparably coupled to the test handler.

In an exemplary embodiment, the test tray transfer apparatus includes: apicking unit transferable in a state where it picks or unpicks the testtray; a first power source for supplying power for transfer of thepicking unit; and a power transmission apparatus for transmitting thepower from the first power source to the picking unit.

In an exemplary embodiment, the picking unit includes: a second powersource for supplying power for picking and unpicking the test tray,being moved by the power transmitted from the power transmissionapparatus; and a picking pin for picking and unpicking the test tray bywith the power of the second power source.

BRIEF DESCRIPTION OF THE DRAWINGS

The above objects, features and other advantages of the presentinvention will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view illustrating a conventional testhandler;

FIG. 2 is a schematic perspective view illustrating an insert-openingapparatus applied to the test handler of FIG. 1;

FIG. 3 is a schematic perspective view illustrating a loading part of atest handler according to an exemplary embodiment of the presentinvention, in which a cover and test trays are not shown;

FIG. 4 is a schematic view illustrating an exemplary pick and placeapparatus, a cover, a test tray, and an insert-opening-apparatus;

FIG. 5 is a schematic perspective view illustrating an exemplaryinsert-opening apparatus of FIG. 3;

FIG. 6A is a front view of an exemplary test tray transfer apparatus ofFIG. 3;

FIG. 6B is a side view of an exemplary test tray transfer apparatus ofFIG. 3;

FIG. 7 is a top view of a test tray according to an exemplary embodimentof the present invention;

FIG. 8A is a partially enlarged view illustrating portion A of FIG. 7;

FIG. 8B is a cross-sectional view taken along lines B-B of FIG. 8A;

FIG. 8C is a cross-sectional view of an exemplary modification of FIG.8B; and

FIG. 9A to FIG. 9H are views for describing exemplary operation statesof the test tray transfer apparatus of FIG. 3.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Detailed reference will now be made to exemplary embodiments of thepresent invention which are illustrated in the accompanying drawings.

FIG. 7 is a top view illustrating a test tray according to an embodimentof the present invention. As shown in FIG. 7, a test tray 500 isconfigured to include a plurality of inserts (not shown), a plurality ofpicking holes 51, and a plurality of sensing holes 52.

The plurality of picking holes 51 correspond to picking pins 45 of apicking unit 400 of a test tray transfer apparatus 200 which will bedescribed later, and allow the picking unit 400 to pick or unpick thetest tray 500.

The plurality of sensing holes 52 correspond to a first position sensor46 of the test tray transfer apparatus 200 and allow the first positionsensor 46 to sense as to whether the picking pin 45 is preciselysituated to couple to the picking hole 51. Also, the plurality ofsensing holes 52 correspond to a second position sensor 33 of aninsert-opening apparatus 300 which will be described later, and allowthe second position sensor 33 to sense as to whether the test tray 500is precisely situated to couple to the insert-opening apparatus 300.

The test tray 500 is implemented in such way that the picking hole 51and the sensing hole 52 are separately formed, as shown in FIG. 8A andFIG. 8B. Here, FIG. 8A is a partially enlarged view illustrating portionA of FIG. 7, and FIG. 8B is a cross-sectional view taken along lines B-Bof FIG. 8A. Also, the test tray 500 may be implemented in such a waythat the picking hole 51 and the sensing hole 52 are formed at the sameaxis Z, as shown in FIG. 8C illustrating a cross-sectional view of FIG.8B.

FIG. 3 is a schematic perspective view illustrating a loading part of atest handler according to an embodiment of the present invention andFIG. 5 is a schematic perspective view illustrating the insert-openingapparatus 300 of FIG. 3. As shown in FIG. 3 and FIG. 5, theinsert-opening apparatus 300 includes three opening units 31 a, 31 b and31 c, three upper limit sensors 32 a-1, 32 b-1, and 32 c-1, three lowerlimit sensors 32 a-2, 32 b-2, and 32 c-2 (reference numbers 32 b-2 and32 c-2 are omitted since the lower limit sensors 32 b-2 and 32 c-2 donot appear in the figure), a second position sensor 33, a set plate 34,a base plate 35, and a base cylinder 36.

The three opening units 31 a, 31 b and 31 c open inserts arrayed in apart of an area of the test tray 500, and include openers 31 a-1, 31b-1, and 31 c-1 and ascending/descending cylinders 31 a-2, 31 b-2, and31 c-2, correspondingly.

The openers 31 a-1, 31 b-1, and 31 c-1 move linearly up and down withrespect to the test tray 500. One side of the openers facing the testtray 500 each form pairs of opening pins 31-1 to open the inserts aspairs of lockers of the inserts are linearly moved.

Here, as shown in FIG. 3 and FIG. 5, each of the openers 31 a-1 and 31c-1 forms 8 pairs of opening pins 31-1 to open 8 inserts,simultaneously. Also, the opener 31 b-1 forms 4 pairs of opening pins31-1 to open 4 inserts, simultaneously.

The ascending/descending cylinders 31 a-2, 31 b-2, and 31 c-2 are eachconfigured by a pair of cylinders which are fixedly installed onto theupper surface of the set plate 34 and transfer the respective openers 31a-1, 31 b-1, and 31 c-1 toward the test tray 500.

The three upper limit sensors 32 a-1, 32 b-1, and 32 c-1 sense as towhether the respective openers 31 a-1, 31 b-1, and 31 c-1 ascend up totheir upper limit heights.

The three lower limit sensors 32 a-2, 32 b-2, and 32 c-2 sense as towhether the respective openers 31 a-1, 31 b-1, and 31 c-1 descend downto their lower limit heights.

The second position sensor 33 senses the sensing hole 52 of the testtray 500 to determine whether the test tray 500 is situated to couple tothe insert-opening apparatus 300.

The set plate 34 may have the ascending/descending cylinders 31 a-2, 31b-2, and 31 c-2 fixedly installed on the upper surface thereof, whichare lined up in a row, and the base plate 35 separably coupled to thelower surface thereof. Namely, the three opening units 31 a, 31 b, and31 c may be coupled to the set plate 34, thereby forming a module.Therefore, when the set plate 34 is separated from the base plate 35,the three opening units 31 a, 31 b, and 31 c are separated at once.

The base plate 35 has the set plate 34 installed on its upper surface.

The base cylinder 36 is fixed to a loading part of the test handler totake up/down the base plate 35.

As shown in FIG. 6A and FIG. 6B, each illustrating a front view and aside view of a test tray transfer apparatus of FIG. 3, the test traytransfer apparatus 200 transfers the test tray 500 such that therelative position of the test tray 500 can be changed with respect tothe insert-opening apparatus 300. The test tray transfer apparatus 200includes a picking unit 400, a motor 27 having a driving pulley 27-1, arotation belt 26 attached between the driving pulley 27-1 and a drivenpulley 27-2, an origin sensor 24, a mounting block 25, a first LM guide42, and a base block 28.

The picking unit 400 moves in picking or un-picking the test tray 500.The picking unit 400 includes a transfer block 41, anascending/descending cylinder 44, a second LM guide 43-1, a second LMguide block 43-2, a picking pin 45, a first position sensor 46, and anorigin sensor pin 24-1.

The transfer block 41 is engaged with the rotation belt 26. The transferblock 41 is guided by the first LM guide 42, and moved by the motor 27.

The ascending/descending cylinder 44 takes up/down anascending/descending cylinder rod 44-1 to provide operation power topick or unpick the test tray 500.

The second LM guide 43-1 and the second LM guide block 43-2 guide partsof the picking unit 400 as the ascending/descending cylinder rod 44-1ascends/descends.

The picking pin 45 descends toward the test tray 500 according todescent of the ascending/descending cylinder rod 44-1 and is inserted tothe picking hole 51 of the test tray 500, thereby picking the test tray500. The picking pin 45 moves as the motor 27 is driven, in picking thetest tray 500. As the ascending/descending cylinder rod 44-1 ascends,the picking pin 45 also ascends and unpicks the test tray 500.

The first position sensor 46 senses positions of the picking holes 51and the sensing holes 52 to determine as to whether the picking pins 45are precisely situated to couple to the picking holes 51.

The origin sensor pin 24-1 is formed to allow the origin sensor 24 tosense the initial position of the picking unit 400.

The motor 27 is fixed to the mounting block 25 to provide power fordriving the picking unit 400. The motor 27 can rotate in forward andreverse directions. The motor 27 may be implemented by a step motor or aservo motor to easily control the position of the picking unit 400.

The rotation belt 26 transmits driving force of the motor 27 to thepicking unit 400, and is attached between the driving pulley 27-1installed to the motor 27 and the driven pulley 27-2 installed oppositeto the driving pulley 27-1 on the mounting block 25.

The origin sensor 24 senses the initial position of the picking unit 400with the origin sensor pin 24-1 of the picking unit 400.

The first LM guide 42 is installed to be engaged with the picking unit400 and guides the picking unit 400.

The mounting block 25 installs the motor 27, the driven pulley 27-2, theorigin sensor 24, and the first LM guide 42 thereto.

The mounting block 25 is fixed to the base block 28. The base block 28couples its lower side to the side wall of the loading part of the testhandler.

Although FIG. 3 is shown in such a way to entirely expose the loadingpart, only a part of upper portion of the insert-opening apparatus 300and a space for movement of the picking pin 45 may be opened because theother portions may be covered by a cover 53 (refer to FIG. 4 of aschematic view illustrating a pick and place-apparatus, a cover, testtrays, and an insert-opening-apparatus). Here, the covered portions maybe utilized by installation of other members.

The following is a description of the loading part of the test handleraccording to an exemplary embodiment of the present invention, referringto FIGS. 9A to 9H. FIG. 9A to 9H are views describing operation statesof the test tray transfer apparatus of FIG. 3.

Firstly, the test tray 500 is placed on the guide rail 50 of FIG. 3, asshown in FIG. 9A. The initial position of the test tray is detected bythe origin sensor 24 and the origin sensor pin 24-1, and the firstposition sensor 46 and the sensing hole 52. When the picking pin 45 issituated at a certain position, the ascending/descending cylinder 44 ofthe picking unit 400 is operated such that the picking pin 45 can bedescended and inserted to the picking hole 51 of the test tray 500. As aresult, the picking unit 400 picks the test tray 500 as shown in FIG.9B.

After that, the motor 27 of the test tray transfer apparatus 200 isdriven. The driving pulley 27-1 is driven as the motor 27 rotatesforwardly (for example, in a clockwise direction). The power of themotor 27 is transmitted to the picking unit 400 through the belt 26 suchthat the picking unit 400 can move to the left in FIG. 9B. The test tray500 is transferred to the left such that the inserts of the first twocolumns of the test tray 500 (two columns in the length-wise directionshown in FIG. 7) can be situated above the insert-opening apparatus 300and be ready to be loaded the semiconductor devices, as shown in FIG.9C.

In the state of FIG. 9C, the second position sensor 33 of theinsert-opening apparatus 300 senses the sensing hole 52 of the test tray500 to determine as to whether the test tray 500 is situated at acertain position. When the test tray 500 is situated at the certainposition, the insert-opening apparatus 300 is operated. As theascending/descending cylinders 31 a-2, 31 b-2 and 31 c-2 of theinsert-opening apparatus 300 are operated, the openers 31 a-1, 31 b-1,and 31 c-1 are lifted up toward the test tray 500 (the upper direction).As a total of 20 opening pins 31-1 formed on the openers 31 a-1, 31 b-1,and 31 c-1 push corresponding stoppers and lockers of the inserts, the20 inserts are opened simultaneously. At this stage, the pick and placeapparatus (referring to FIG. 4) supplies and loads the 20 pickedsemiconductor devices to the 20 opened inserts. When the semiconductordevices are loaded, the ascending/descending cylinders 31 a-2, 31 b-2,and 31 c-2 take down the openers 31 a-1, 31 b-1, and 31 c-1 and then theinserts are closed. Since typical operation of the an insert-openingapparatus is publicly well-known, the illustration thereof is omitted inthe drawings.

After that, as the motor 27 is operated, the test tray 500 istransferred by two columns of the inserts (two columns in thelength-wise direction shown in FIG. 7).

Afterwards, the above-described processes (sensing by the secondposition sensor 33; ascending by the openers 31 a-1, 431 b-1 and 31 c-1;loading by the pick and place apparatus; descending by the openers 31a-1, 3 b-1, and 31 c-1; and transferring of the test tray 500 by themotor 27, which are hereinafter referred to as ‘process A’) arerepeated.

As shown in FIG. 9D, process A stops when the picking unit 400 arrivesat the left limit of the test tray transfer apparatus 200. When theascending/descending cylinder 44 of the picking unit 400 takes up thepicking pin 45, the picking unit 400 unpicks the test tray 500 as shownin FIG. 9E.

The picking unit 400 unpicking the test tray 500 is transferred to theright by the operation of the motor 27 such that the picking pin 45 issituated to another picking hole 51 as shown in FIG. 9F.

The picking unit 400 picks the test tray 500 by the operation of theascending/descending cylinder 44 and then the process A is repeated.

As shown in FIG. 9G, before the semiconductor devices are loaded to thelast two columns of the inserts of the test tray 500, a bufferascending/descending apparatus (not shown) takes up a following testtray 501 and places it on the guide rail 50.

The test tray transfer apparatus 200 un-picks the test tray 500 andreturns to its initial position. The origin sensor 24 and first positionsensor 46 sense the initial position to allow the test tray transferapparatus 200 to pick a following test tray 501 (like the processesillustrated in FIG. 8A and FIG. 8B). The following test tray 501 istransferred upward the insert-opening apparatus 300. Here, the foregoingtest tray 500 situated at the last loading position is pushed out by afollowing test tray 501 as shown in FIG. 8H. After that, the test tray500 is transferred to another part (for example, a chamber or arotator). The loading part keeps on loading the following test tray 501.As a result, since the foregoing test tray 500 and the following testtray 501 are continuously loaded without a time interval, the loadingtime can be reduced.

When the semiconductor devices to be tested change size, replacementwork of the test tray is performed in such a way that: the transfervalue (which corresponds to the two columns of the inserts in thelengthwise direction in FIG. 7) of the test tray transfer apparatus 200must be modified; the base cylinder 36 of the insert-opening apparatus300 is operated to move the base plate 35 upward; the set plate 34 isseparated; and a set plate to which opening units corresponding to anewly replaced test tray are installed is coupled thereto.

The test tray transfer apparatus 200 may be implemented in such a waythat it can be repeatedly and reciprocately operated by an inputtedtransfer value. Namely, the test tray transfer apparatus 200 may repeatthe following processes: picking the test tray 500 by the picking unit400; transferring the test tray 500 based on the inputted transfervalue; unpicking the test tray 500 by the picking unit 400; andreturning of the picking unit 400 based on the inputted transfer value.

The test tray transfer apparatus 200 may be variously modified from theexemplary embodiment in such a way that it can transmit power of themotor to the picking unit 400 through a screw shaft and screw nutsinstead of the rotation belt, or it can change the position of thepicking unit 400 using a cylinder instead of the motor as a powersource.

Although the foregoing description described the present invention asapplied to a loading part, the present invention can be adapted to anunloading or other parts as well.

As described above, according to the present invention, all of theinserts of the test tray can be operated by the insert-opening apparatusarrayed in a part of an area of the test tray as the test tray istransferred. Therefore, the test handler according to the presentinvention can reduce the number of components, thereby decreasing itsmanufacturing costs, and maintenance costs accompanied with replacementwork. Also, a plurality of opening units may be integrated to form amodule as they are coupled to a set plate, and thus the module isseparably coupled to the test handler. Therefore, the replacement workof the test tray can be easily performed and the replacement work timecan be reduced. Also, such a module can be easily applied to varioustypes of testers.

By improving the transferring process of the test tray in the loadingpart, the time interval between a loading completion time point of atest tray and a loading start time point of a following test tray can begreatly reduced. As a result, the loading time of the semiconductordevices can be reduced.

Also, as the loading part reduces its exposed portion, it preventsforeign matter including the semiconductor devices from falling onto thetest tray. In addition, the space formed by covering the loading partcan dispose other parts, and the volume of the test handler is reduced.

Furthermore, by reducing the moving point of the pick and placeapparatus, jams can be reduced, teaching work can be easily performed,and teaching time can be reduced.

Although the exemplary embodiments of the present invention have beendisclosed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and spirit of the inventionas disclosed in the accompanying claims.

1. A test handler comprising: a first loading member on which aplurality of semiconductor devices are loaded; a second loading memberfor loading the plurality of semiconductor devices; and a pick and placeapparatus for transferring and supplying the semiconductor devices ofthe first loading member to the second loading member, wherein thesecond loading member repeatedly performs being transferred and stoppedin response to the semiconductor devices supplying operation of the pickand place apparatus such that the supplying position of the pick andplace apparatus to the second loading member is substantially invariant.2. The test handler according to claim 1, further comprising: atransferring apparatus for transferring and stopping the second loadingmember; and an opening apparatus for assisting the pick and placeapparatus to load the semiconductor devices to the second loadingmember.
 3. The test handler according to claim 2, wherein: the secondloading member includes at least one picking hole, and at least onesensing hole; the transferring apparatus includes a picking unit forpicking the picking hole and a sensing unit for sensing the sensinghole; and the opening apparatus includes a sensing unit for sensing thesensing hole.
 4. A test handler comprising: a test tray on which aplurality of inserts for loading at least one semiconductor device arearrayed; at least one opening unit for simultaneously opening one partof the plurality of inserts, which are arrayed on one part of the testtray; and a test tray transfer apparatus for transferring the test tray;wherein the opening unit simultaneously opens a plurality of inserts inone part of the test tray, and the test tray transfer apparatustransfers the test tray to cause the opening unit to simultaneously opena plurality of inserts in another part of the test tray.
 5. The testhandler according to claim 4, further comprising a pick and placeapparatus for supplying the semiconductor devices to and withdrawing thesemiconductor devices from the test tray, wherein the test tray transferapparatus transfers the test tray regardless of operations of the pickand place apparatus.
 6. The test handler according to claim 4, furthercomprising a loading part for receiving the test tray and loading thesemiconductor devices on the test tray, wherein the loading partincludes the opening unit and the test tray transfer apparatus.
 7. Thetest handler according to claim 6, wherein: the loading part includes acover for covering most parts of the test tray received to the loadingpart, wherein the cover forms an opening section for exposing aplurality of inserts arrayed on a part of the test tray.
 8. The testhandler according to claim 4, wherein the test tray includes: at leastone picking hole formed at a part of the test tray; and at least onesensing hole formed at a part of the test tray.
 9. The test handleraccording to claim 8, wherein: the at least one picking hole is arrayedin a row in a proceeding direction of the test tray; and the at leastone sensing hole is arrayed in a row in the proceeding direction of thetest tray.
 10. The test handler according to claim 4, wherein theopening unit includes: an opener for contacting and opening theplurality of inserts arrayed on the part of the test tray; and a lineartransfer apparatus for transferring the opener to the plurality ofinserts such that the opener can contact the plurality of inserts. 11.The test handler according to claim 10, wherein the opening unit isformed as a module to be separably coupled to the test handler.
 12. Thetest handler according to claim 4, wherein the test tray transferapparatus includes: a picking unit transferable in a state where itpicks or unpicks the test tray; a first power source for supplying powerfor transfer of the picking unit; and a power transmission apparatus fortransmitting the power from the first power source to the picking unit.13. The test handler according to claim 12, wherein the picking unitincludes: a second power source for supplying power for picking andunpicking the test tray being moved by the power transmitted from thepower transmission apparatus; and a picking pin for picking andunpicking the test tray with the power of the second power source.